Reducing TCO and TCE Effectively
More Compute, Greater Efficiency
High density designs with Supermicro’s resource saving architecture and shared power & cooling
FlexTwin™
Purpose-built HPC-at-scale solution
| CPU | Intel® Xeon® 6900 series, Intel Xeon 6+, or AMD EPYC™ 9006 series processors |
|---|---|
| Max Memory | Up to 32 DIMMs, 9TB DDR5 or 8TB MRDIMM per node |
| Max Drives | Up to 2 E1.S NVMe per node |
| PCIe | Up to 2 PCIe 6.0 slots + 1 PCIe 6.0 AIOM slot or 2 PCIe 5.0 slots + 1 PCIe 5.0 AIOM slot per node |
| Node Configuration | 1-OU 2-node or 2U 4-node |
Liquid-Cooled Universal GPU Systems
Direct-to-chip liquid-cooled systems for high-density AI infrastructure at scale.
GPU: NVIDIA HGX B300/B200/H200
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 9TB
Drives: Up to 24 Hot-swap U.2 or 2.5″ NVMe/SATA drives
Universal GPU Systems
Modular Building Block Design, Future Proof Open-Standards Based Platform in 4U, 5U, 8U, or 10U for Large Scale AI training and HPC Applications
GPU: NVIDIA HGX B300/B200/H200, AMD Instinct MI350 Series and MI325X/MI300X/MI250 OAM Accelerator, Intel Data Center GPU Max Series
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 9TB
Drives: Up to 24 Hot-swap E1.S, U.2 or 2.5″ NVMe/SATA drives
3U/4U/5U GPU Lines with PCIe 5.0
Maximum Acceleration and Flexibility for AI, Deep Learning and HPC Applications
GPU: Up to 10 NVIDIA H100 PCIe GPUs, or up to 10 double-width PCIe GPUs
CPU: Intel® Xeon® or AMD EPYC™
Memory: Up to 32 DIMMs, 9TB or 12TB
Drives: Up to 24 Hot-swap 2.5″ SATA/SAS/NVMe
NVIDIA MGX™ Systems
Modular Building Block Platform Supporting Today's and Future GPUs, CPUs, and DPUs
GPU: Up to 4 NVIDIA PCIe GPUs including NVIDIA RTX PRO™ 6000 Blackwell Server Edition, H200 NVL, H100 NVL, and L40S
CPU: NVIDIA GH200 Grace Hopper™ Superchip, Grace™ CPU Superchip, or Intel® Xeon®
Memory: Up to 960GB ingegrated LPDDR5X memory (Grace Hopper or Grace CPU Superchip) or 16 DIMMs, up to 4TB DRAM (Intel)
Drives: Up to 8 E1.S + 4 M.2 drives